摘要： 职称论文发表为提高高岭土与环氧树脂基体的相容性以及高岭土粒子在基体当中的分散稳定性，采用简单的高温干法改性，在高岭土表面接枝环氧树脂分子。高岭土与环氧树脂分子之间通过化学键相连，接枝率高达21.65 wt %。经过环氧树脂改性后的高岭土接触角(101.28 )远高于未改性高岭土接触角(12.65 )。证明表面有机化以后，高岭土粒子的疏水性能显著提高。通过观察扫面电子显微照片，发现改性后的高岭土在有机溶剂和环氧树脂基体中均能够稳定分散。在高岭土和环氧树脂基体复合过程中，未添加任何溶剂，环保且成本低廉。固化后复合材料的热稳定性和储能模量显著提高。由于高岭土本身优异的电绝缘性，当改性高岭土的添加量低于30 wt %时，复合材料的介电常数均低于纯环氧树脂的，整个体系中制备的复合材料均表现出良好的介电性能。因此有望制备高性能环氧树脂/高岭土复合材料，将其应用于微电子封装领域。
关键词： 聚合物/无机粒子复合材料；高岭土；环氧树脂；表面改性

Liu Xin， He Aixiao， Guo Jinshan^*

 

Abstract： To improve the compatibility and dispersion stability of kaolin (K) in epoxy matrix, oligomeric epoxy was employed to modify K by a simple dry-method. After modification, epoxy resin was successfully grafted on the surface of K through chemical bonds, and the grafting rate was as high as 21.65 wt%. The contact angle of EP-K (101.28 ) was much higher than that of the pristine K (12.65 ). It was proved that the hydrophobic nature of organically modified K was improved significantly. Compared with the raw K, SEM demonstrated that the EP-K exhibited a homogeneous dispersion in organic solvent or in epoxy matrix. The EP-K /EP composites fabricated by solvent-free method possessed improved thermal stability and significant improvement on storage modulus. Due to the excellent insulation of K and the homogeneous dispersion, the dielectric constant of composites was lower than neat epoxy with the EP-K≤30 wt%. Compared with the non-modified K composite, the modification of K on permittivity of the composite was encouraged. However, all of the EP-K/EP composites still maintained a good insulating property. Hence the material developed in this work could be explored for a possible high performance and industrial application as microelectronic encapsulation material.
Keywords： polymer/inorganic-particles composite; kaolin; epoxy; surface-modification