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总览 评价 张宇 * ， 杨雪霞 ， 赵振东 ， 树学峰 （ 太原理工大学应用力学与生物医学工程研究所； ） 摘要： 本文研究了塑封焊球阵列封装器件（PBGA）中SnPb焊点在-55～125℃热循环条件下的可靠性问题，分析了在高度相同，焊盘尺寸相同的情况下，焊点形状（
张宇*， 杨雪霞， 赵振东， 树学峰
（
太原理工大学应用力学与生物医学工程研究所； ）
摘要：
本文研究了塑封焊球阵列封装器件（PBGA）中SnPb焊点在-55～125℃热循环条件下的可靠性问题，分析了在高度相同，焊盘尺寸相同的情况下，焊点形状（桶形、柱形、沙漏形）对焊点可靠性的影响。用有限元方法模拟了焊点在热循环加载条件下的应力应变分布，计算了焊点的应力应变最大值，得出最外侧焊点的等效塑性应变最大，最容易失效。此外，根据有限元模拟得到的等效塑性应变值，结合修正的Coffin-Manson经验方程对三种不同形状焊点在热循环载荷下的疲劳寿命进行了预测，计算得到沙漏形焊点的疲劳寿命远大于柱形和桶型焊点的疲劳寿命。该计算结果为电子封装工艺中焊点的形状设计提供了一定理论基础。
关键词：
焊点可靠性；焊点形状；有限元方法；热循环；Coffin-Manson模型；疲劳寿命
zhangyu1,*， Yang Xuexia2,， Zhao Zhendong2,， Shu Xuefeng2,
（
1、Taiyuan University of Technology； 2、Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology； ）
Abstract：
SnPb solder joints reliability under thermal cycling conditions(-55℃~125℃) were investigated in this paper, and the effects of solder joint shape（barrel, cylinder, hourglass）on joint reliability were analysed for the same joint height and the same copper pad size. Finite element method was used to simulate the distribution of stress and strain of solder joints, and calculate the maximum of stress and strain under thermal cycling condition, the result show that the outmost solder joints, the equivalent strain of which was maximum, were the most likely to crack. In addition, the fatigue lives of three kinds of solder joints mentioned above were predicted using a modified Coffin–Manson empirical equation and the value of the equivalent plastic strain based on the finite element result under thermal cycling condition, the result showed that barrel solder joints have larger fatigue lives than the cylinder and hourglass solder joints. The results provided a theoretical basis for the design of the solder joints shape for Electronic Packaging technology.
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