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总览 评价 白创 1， ， 袁国政 2， ， 树学锋 2，* （ 1、 太原理工大学应用力学与生物医学工程研究所，太原 030024； 2、 太原理工大学应用力学与生物医学工程研究所，太原市 030024； ） 摘要： 本文采用自由跌落的试验方法，研究BGA（球栅阵列）封装自由
白创1，， 袁国政2，， 树学锋2，*
（
1、太原理工大学应用力学与生物医学工程研究所，太原 030024； 2、太原理工大学应用力学与生物医学工程研究所，太原市 030024； ）
摘要：
本文采用自由跌落的试验方法，研究BGA（球栅阵列）封装自由跌落冲击到不同材质基板上的可靠性。用型号RS-DP-03A跌落台模拟真实工况下BGA封装芯片的跌落行为，接触面是钢制基板时，使其跌落条件满足JEDEC22-B111标准（脉冲峰值1500g，脉冲持续时间0.5ms），并以同一高度跌落到木质基板上，对比分析引起芯片焊点产生裂纹、扩展直至失效的机理。对失效封装芯片进行染色试验，观察BGA封装中焊点的失效位置和焊点内部裂纹的形貌，根据观察结果分析和讨论封装芯片在自由跌落条件下，不同接触面对封装芯片失效的响应。
关键词：
电子封装；自由跌落；裂纹增长；疲劳失效
Bai Chuang1,， Yuan Guozheng2,， Shu Xuefeng2,*
（
1、TAIYUAN UNIVERSITY OF TECHNOLOGY INSTITUTE OF APPLIED MECHANICS & BIOMEDICAL ENGINEERING,TaiYuan 030024； 2、TAIYUAN UNIVERSITY OF TECHNOLOGY INSTITUTE OF APPLIED MECHANICS & BIOMEDICAL ENGINEERING,TAIYUAN CITY 030024； ）
Abstract：
The method of drop-free was used in this paper to study the reliability of BGA(ball grid array) package when it fell on different baseplates in the process of drop-free. The model RS-DP-03A drop device was used to simulate the falling behavior of BGA chip packages under the real conditions. The drop condition meet the JEDEC22-B111 standards (pulse peak 1500 g, pulse duration 0.5 ms) when the contact surfaces are steel substrates, the BGA chip packages were dropped from the same height to the wooden boards; the mechanism from the crackle occurred to the crack extensive to the failure occurred of the chip solder joints was analyzed comparatively.Stain tests were carried on the expired chip packages, observing the failure position of solder joints and the internal appearance of cracks; analyzing and discussing the failure response of the chip packages to the different interfaces under the condition of drop-free.
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